Sony has implemented a discrete internal update to the PlayStation 5 Slim (and some standard PS5) units, refining the liquid-metal thermal interface material (TIM) layout to reduce the risk of coolant leaks and improve long-term thermal stability. The newest PS5 Slim hardware revisions, identified by model codes “CFI-2100/2200,” now adopt the same refined TIM application that first appeared in the PlayStation 5 Pro. Instead of a simple blob of liquid metal between the APU and heatsink, Sony’s updated design uses engraved grooves or trenches to better secure the metal — effectively containing it around the SoC and preventing migration or spill.
This change aims to address a recurring concern among PS5 owners: over time, liquid-metal has been prone to pooling or leaking, especially when the console was placed vertically or moved frequently. That could lead to uneven cooling, “dry spots” on the APU, increased fan noise, and in some cases, long-term hardware stress. With the new TIM layout, such risks are significantly reduced, which should enhance cooling performance and stability over many years of use.
From a hardware standpoint, nothing else has changed. The APU remains the same, the chassis and external design are untouched, and the fan/heat dissipation system appears identical aside from the TIM improvement. However, this small internal tweak can have outsized benefits for reliability, especially for those who store their console vertically or in tight spaces.
For current PS5 Slim owners who have not experienced overheating or fan-speed issues, no action is strictly required. But for those concerned with longevity, or who operate their consoles in vertical orientation, it may be worthwhile to consider a professional re-application of liquid metal — though such a procedure always carries risks. For anyone buying a new PS5 Slim, we recommend checking the model number: CFI-2100/2200 units should have the updated, leak-resistant TIM layout.
Sources: modyfikatorcasper 1, modyfikatorcasper 2